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Beneq Oy TFS 200

ALD Temperatur Range
25 - 500 °C
ALD Loading
Manual, Loadlock
ALD Substrate Size
up to 200 mm, customized
ALD Plasma Enhanced (PEALD)
CCP
ALD Insitu Diagnostics
PLC Control
The TFS 200 is the most flexible Atomic Layer Deposition research platform ever designed for research and development. All details of the system are realized with flexibility, modularity and ease of use in mind. With the TFS 200, the freedom of coating and application development is placed completely in the hands of the operator, not limiting it by system-related restrictions.

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