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Beneq Oy TFS 500

ALD Loading
Loadlock
ALD Substrate Size
up to 200 mm (single), up to 450 x 300 x 250 (3D batch)
ALD Plasma Enhanced (PEALD)
CCP
ALD Insitu Diagnostics
PLC Control
Atomic Layer Deposition TFS 500 is designed for diverse use in thin film coating applications. Being the first Beneq reactor model, has proven its case as a versatile tool for both in-depth thin film research and robust batch processing. The TFS 500 is an ideal tool for multi-project environments.


The TFS 500 can handle several types of substrates; wafers, planar objects, particles and porous bulk materials, as well as complex 3D objects with high aspect ratio features. It can further be equipped with a manually operated load lock for increased wafer processing capabilities. Different types of reaction chambers can easily be fitted inside the vacuum chamber, which in turn enables optimizing each reaction chamber for each customer application.

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