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Oxford Instruments FlexAL Atomic Layer Deposition

ALD Temperatur Range
25 ºC - 400 ºC, 550 ºC optional)
ALD Loading
Loadlock, Cassette-to-Cassette
ALD Substrate Size
up to 200 mm
ALD Plasma Enhanced (PEALD)
ALD Insitu Diagnostics
ALD Glovebox Integration
The FlexAL systems provide a new range of flexibility and capability in the engineering of nanoscale structures and devices by offering remote plasma atomic layer deposition processes and thermal ALD within a single ALD system.

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