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Sundew Developer ALD for Research

ALD Temperatur Range
75 - 400°C
ALD Loading
Loadlock option
ALD Substrate Size
up to 300 x 300 mm
ALD Plasma Enhanced (PEALD)
ALD Insitu Diagnostics
QSM and others
ALD Glovebox Integration
Sundew’s Developer line is specifically designed for R&D, yet it uses the same advanced features of our production systems. It is a low-cost versatile ALD system that fits most R&D budgets. The flexible chamber design allows for both round up to 350 mm substrate chuck that fits semiconductor wafers, or square parts carrying tray that better accommodates panels or randomly shaped parts.

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